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Features
* * * * * * * * *
800-2500 MHz operating frequency Very low noise floor performance Very good carrier and sideband suppression Supports wideband baseband input Low LO drive requirements Power-down mode No external IF filter Supply voltage 5 V Small SSOP16 package
Applications
* * * *
Infrastructure digital communication systems DCS/PCS/UMTS transceivers ISM band transceivers GMSK, QPSK, QAM, 8PSK, SSB modulators
800 - 2500 MHz Direct Quadrature Modulator T0790
Electrostatic sensitive device. Observe precautions for handling.
Description
The T0790 is a direct quadrature modulator using Atmel's Silicon-Germanium (SiGe) process. It features a frequency range from 800 MHz up to 2500 MHz with excellent carrier and sideband suppression and a low noise floor. The typical output power is 10 dBm with an IM3 suppression greater than 60 dB. The T0790 targets a wide range of communication applications including 3G wireless.
Block Diagram
Figure 1.
16 1
BBQN BBQP
LOP LON
4 5
0 90
13 12
RFP RFN
BBIP BBIN
8 9
Rev. A2, 30-Nov-01
Preliminary Information
1 (11)
Preliminary Information
Ordering Information
Extended Type Number T0790 SSOP16 Package t.b.d. Remarks
Pin Configuration
Figure 2. Pinning
BBQP VCC GND LOP LON GND /SD BBIP 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 BBON VCC GND RFP RFN GND VCC BBIN
Pin Description
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol BBQP VCC GND LOP LON GND /SD BBIP BBIN VCC GND RFN RFP GND VCC BBQN Q-channel baseband, positive input +5 V power supply Ground Local oscillator, positive input Local oscillator, negative input Ground Shut-down control I-channel baseband, positive input I-channel baseband, negative input +5 V power supply Ground RF, negative output RF, positive output Ground +5 V power supply Q-channel baseband, negative input Function
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T0790
Rev. A2, 30-Nov-01
T0790
Absolute Maximum Ratings
All voltages are referred to GND.
Parameter Supply voltage LO, RF input Input voltage Operating temperature Storage temperature Symbol VCC LOP, LON, RFP, RFN BBIP, BBIN, BBQP, BBQN TOP Tstg Value 5.5 10 0 to 3 -40 to +85 -65 to +150 Unit V dBm V C C
Thermal Resistance
Parameter Junction ambient Symbol RthJA Value t.b.d. Unit K/W
Electrical Characteristics
Test conditions: Vcc = +5 V, Tamb = +25C, Baseband inputs: 1.9 V DC bias, 200 kHz frequency, 300 mV p-p, 600 m V p-p differential drive, I/Q signals in quadrature, LO input: -5 dBm @ 2000 MHz
No. 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Parameters RF output Frequency range Output power RF port return loss 1dB-output compression point LO leakage Sideband suppression IM3 suppression Two-tone baseband input @ 600mVp-p differential per tone Baseband inputs tied to 1.9 VDC, -20 MHz offset from LO Matched to 50 ref Compression point 12, 13 12, 13 12, 13 12, 13 12, 13 12, 13 12, 13 f PRF out RL P1dB ALO ASB AIM3 +34 800 -14 14 +3 -40 40 65 -32 -11.5 2500 -9 MHz dBm dB dBm dBm dB dB B A D A D D D Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
1.8
Broadband noise floor Quadrature phase error I/Q amplitude balance
12, 13
Pnoise
-154
-148
dBm/ Hz deg dB
C
1.9 1.10
12, 13 12, 13
-2 -0.2
+2 +0.2
B B
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Preliminary Information
Rev. A2, 30-Nov-01
3 (11)
Preliminary Information
Electrical Characteristics
Test conditions: Vcc = +5 V, Tamb = +25C, Baseband inputs: 1.9 V DC bias, 200 kHz frequency, 300 mV p-p, 600 m V p-p differential drive, I/Q signals in quadrature, LO input: -5 dBm @ 2000 MHz
No. 2 2.1 Parameters Modulation input Baseband frequency input Baseband input resistance Baseband input capacitance LO input Usable LO frequency LO drive level LO port return loss Miscellaneous Shut-down attenuation Shut-down pin resistance Shut-down pin capacitance Shut-down input thresholds Shut-down settling time Supply voltage Supply current @ 1MHz @ 1MHz 7 7 7 7 7 2, 10, 15 2, 10, 15 +4.75 60 ASD RSD CSD 60 11.9 5.2 CMOS <500 +5 73 +5.25 80 dB k pF -- ns V mA A A D D D D Matched to 50 ref 4, 5 4, 5 4, 5 fLO PLO RLLO 800 -8 14 -5 2500 -2 MHz dBm dB B D C -3dB bandwidth, baseband inputs terminated in 50 Per pin Per pin 1, 8, 9, 16 1, 8, 9, 16 1, 8, 9, 16 fBB DC 1000 MHz D Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
2.2 2.3 3 3.1 3.2 3.3 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7
RBB CBB
4.4 0.5
k pF
D D
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Figure 3. SSB power vs. LO frequency
Fig.1 SSB Power vs. LO Frequency
-5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -15 800
SSB Power (dBm)
1000
1200
1400
1600
1800
2000
2200
2400
LO Frequency (MHz)
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T0790
Rev. A2, 30-Nov-01
T0790
Figure 4. Output P1dB vs. LO frequency Fig.2 Output P1dB vs. LO Frequency
10 9 8 7 6 5 4 3 2 1 0 800
Output P1dB (dBm)
1000
1200
1400
1600
1800
2000
2200
2400
LO Frequency (MHz)
Figure 5. Carrier feedthrough vs. LO frequency
Fig.3 Carrier Feedthrough vs. LO Frequency
-30 -32 -34 -36 -38 -40 -42 -44 -46 -48 -50 800
Carrier Feedthrough (dBm)
1000
1200
1400
1600
1800
2000
2200
2400
LO Frequency (MHz)
Figure 6. Sideband suppression vs. LO frequency Fig.4 Sideband Suppression vs. LO Frequency
50 48 46 44 42 40 38 36 34 32 30 800
Sideband Suppression (dB)
1000
1200
1400
1600
1800
2000
2200
2400
LO Frequency (MHz)
Preliminary Information
Rev. A2, 30-Nov-01
5 (11)
Preliminary Information
Figure 7. Intermodulation distortion vs. SSB output power
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -12.0 -10.0 -8.0 Output Power (dBm)
fundamental (each tone) 3rd intermod. (each tone)
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
BB input level (dBVp-p diff.)
Small Signal S-Parameter
RF Port Frequency (MHz)
800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500
LO Port Differential Mag.
0.125 0.141 0.156 0.171 0.186 0.200 0.214 0.227 0.240 0.253 0.265 0.277 0.289 0.301 0.312 0.322 0.333 0.343
Single-Ended Mag.
0.364 0.366 0.368 0.370 0.372 0.374 0.377 0.380 0.383 0.387 0.391 0.395 0.398 0.402 0.404 0.406 0.407 0.408
Single-Ended Mag.
0.948 0.940 0.931 0.921 0.910 0.898 0.886 0.873 0.859 0.845 0.830 0.814 0.798 0.781 0.765 0.748 0.732 0.716
Differential Mag.
0.106 0.119 0.132 0.145 0.158 0.171 0.184 0.197 0.210 0.223 0.236 0.248 0.261 0.273 0.286 0.298 0.310 0.322
Ang.
162.7 160.3 157.9 155.6 153.3 151.1 148.8 146.6 144.4 142.2 139.9 137.6 135.2 132.7 130.3 128.0 125.7 123.6
Ang.
89.26 86.34 83.74 81.38 79.2 77.18 75.27 73.48 71.77 70.15 68.6 67.12 65.71 64.35 63.04 61.79 60.58 59.41
Ang.
-29.69 -33.43 -37.18 -40.95 -44.75 -48.56 -52.39 -56.25 -60.13 -64.03 -67.96 -71.89 -75.84 -79.79 -83.77 -87.78 -91.83 -95.94
Ang.
81.92 80.9 79.89 78.88 77.87 76.87 75.86 74.85 73.85 72.84 71.84 70.84 69.84 68.84 67.84 66.85 65.86 64.86
Notes:
1) 2) 3) 4)
VCC = +5.0V, T = +25C. For single-ended S-parameters, the corresponding differential pin is left floating. Data is referenced to the foot of the package lead and does not include the applications circuit. All data simulated.
6 (11)
T0790
Rev. A2, 30-Nov-01
T0790
Application Circuit
Figure 8.
+5V
L1
VCC
P8
P9
C3 C6
VCC R1 1 2 3 4 5 6 7 8 D1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 R7 16 15 14 13 12 11 10 9
VCC C9
LOin P10 8 C1 1 T3 5 4
C4
C10 4 5 T4 1 8 RFout C16 C2 P11
C5 C17
T0790
R9 SH1 R8 P12
R10 VCC
C18
P13
Component Designator D1
Value
Vendor
Part Number Description I/Q modulator SMA connector, end launch with tab, for 142-0701-856 EHF-FD1619 .062 inch thick board RF transformer, 1200 to 2200 MHz Inductor, 1210 footprint, +/- 10% tolerance Resistor, 1206 footprint Resistor, 0603 footprint, Capacitor, 0603 footpr., COG dielectric, +/- 0.25 pF Capacitor, 0603 footpr.,COG dielectric, +/- 5% Capacitor, 1206 footpr., Y5V dielectric, 16 V rating Capacitor, 0603 footpr., COG dielectric, +/- 0.25 pF Capacitor, 0603 footpr., COG dielectric, +/- 0.25 pF Shunt for 2-pin header
Atmel Johnson
T0790
P8, P9, P10, P11, P12, P13 T3, T4 L1 R1, R7, R9, R10 R8 C6,C18 C9,C17 C3 C4, C5, C10, C16 C1, C2 SH1 1:1 1 H 200 1 k 6.8 pF 1 nF 2.2 F 2.2 pF 0.5 pF
Components Panansonic
Note:
May vary due to printed board layout and material.
Preliminary Information
Rev. A2, 30-Nov-01
7 (11)
Preliminary Information
Demo Test Board (Fully Assembled PCB)
Figure 9.
2" P8 P9
1 2 H1 2" L1 R1 P10 T3 C6 C4 C5 C17 R8 R9 H2 1 2 SH1 R10 P14 R7 C9 C10 C16 C18 P11 T4 C2 C3
C1
P12
P13
Recommended Package Footprint
Figure 10.
1.25
3.0 0.30 0.62 0.62
0.35
3.0
0.25 via
0.7
0.9
6.9
all units are in mm - Indicates metalization - vias connect pad to underlying ground plane
8 (11)
T0790
Rev. A2, 30-Nov-01
T0790
Package Information
Preliminary Information
Rev. A2, 30-Nov-01
9 (11)
Preliminary Information
Ozone Depleting Substances Policy Statement
It is the policy of Atmel Germany GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Atmel Germany GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Atmel Germany GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
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T0790
Rev. A2, 30-Nov-01
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Web Site
http://www.atmel-wm.com
(c) Atmel Germany GmbH 2001. Atmel Germany GmbH makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Atmel Germany GmbH's Terms and Conditions. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel Germany GmbH are granted by the Company in connection with the sale of Atmel Germany GmbH products, expressly or by implication. Atmel Germany GmbH's products are not authorized for use as critical components in life support devices or systems. Data sheets can also be retrieved fron the Internet: http://www.atmel-wm.com
Rev. A2, 30-Nov-01

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